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Investigating stress measurement capabilities using GHz scanning acoustic microscopy for 3D failure analysis

dc.contributor.authorKhaled, Ahmad
dc.contributor.authorBrand, Sebastian
dc.contributor.authorKogel, M.
dc.contributor.authorAppenroth, T.
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-23T11:45:17Z
dc.date.available2021-10-23T11:45:17Z
dc.date.issued2016
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26823
dc.sourceIIOimport
dc.titleInvestigating stress measurement capabilities using GHz scanning acoustic microscopy for 3D failure analysis
dc.typeJournal article
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage336
dc.source.endpage340
dc.source.journalMicroelectronics Reliability
dc.source.volume64
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271416302050
imec.availabilityPublished - imec
imec.internalnotesESREF conference 19-22 sept. 2016


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