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In-line critical dimension and sidewall roughness metrology study for compound nanostructure process control by in-line 3D atomic force microscopy

dc.contributor.authorKim, Tae-Gon
dc.contributor.authorRyu, Henry
dc.contributor.authorJo, Ah-jin
dc.contributor.authorCho, Sang-Joon
dc.contributor.authorPark, Sang-il
dc.contributor.authorVandeweyer, Tom
dc.date.accessioned2021-10-23T11:48:18Z
dc.date.available2021-10-23T11:48:18Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26832
dc.sourceIIOimport
dc.titleIn-line critical dimension and sidewall roughness metrology study for compound nanostructure process control by in-line 3D atomic force microscopy
dc.typeMeeting abstract
dc.contributor.imecauthorVandeweyer, Tom
dc.source.peerreviewyes
dc.source.beginpage1950
dc.source.conference230th ECS Meeting: Pacific Rim Meeting - PRiME
dc.source.conferencedate2/10/2016
dc.source.conferencelocationHonolulu, HI USA
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2016-02/30/1950.abstract
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2016-02


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