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Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorBeyne, Eric
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T11:49:46Z
dc.date.available2021-10-23T11:49:46Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26836
dc.sourceIIOimport
dc.titleImpact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging
dc.typeProceedings paper
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1778
dc.source.endpage1785
dc.source.conferenceIEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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