Show simple item record

Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter

dc.contributor.authorLi, Yunlong
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorRoussel, Philippe
dc.contributor.authorBrouri, Mohand
dc.contributor.authorGopinath, Sanjaj
dc.contributor.authorM. Anjos, Daniela
dc.contributor.authorThorum, Matthew
dc.contributor.authorYu, Jengyi
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-23T12:12:26Z
dc.date.available2021-10-23T12:12:26Z
dc.date.issued2016
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26906
dc.sourceIIOimport
dc.titleDielectric liner reliability in via-middle through silicon vias with 3 micron diameter
dc.typeJournal article
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage37
dc.source.endpage40
dc.source.journalMicroelectronic Engineering
dc.source.volume156
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S016793171630034X
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record