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Articles
Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter
Publication:
Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter
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Date
2016
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Van Huylenbroeck, Stefaan
;
Roussel, Philippe
;
Brouri, Mohand
;
Gopinath, Sanjaj
;
M. Anjos, Daniela
;
Thorum, Matthew
;
Yu, Jengyi
;
Beyer, Gerald
;
Beyne, Eric
;
Croes, Kristof
Journal
Microelectronic Engineering
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1978
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Views
1978
since deposited on 2021-10-23
1
last month
1
last week
Acq. date: 2026-01-25
Citations