Publication:

Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter

Date

2016
Journal article
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dc.contributor.authorLi, Yunlong
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorRoussel, Philippe
dc.contributor.authorBrouri, Mohand
dc.contributor.authorGopinath, Sanjaj
dc.contributor.authorM. Anjos, Daniela
dc.contributor.authorThorum, Matthew
dc.contributor.authorYu, Jengyi
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-23T12:12:26Z
dc.date.available2021-10-23T12:12:26Z
dc.date.issued2016
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26906
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S016793171630034X
dc.source.beginpage37
dc.source.endpage40
dc.source.journalMicroelectronic Engineering
dc.source.volume156
dc.title

Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter

dc.typeJournal article
dspace.entity.typePublication
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