Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter

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Author(s)

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Van Huylenbroeck, Stefaan

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Roussel, Philippe

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Gopinath, Sanjaj

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M. Anjos, Daniela

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Thorum, Matthew

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Journal

Microelectronic Engineering

Metrics

1973 since deposited on 2021-10-23

Acq. date: 2025-10-22