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Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs

dc.contributor.authorMaggioni, Federica
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-23T12:24:19Z
dc.date.available2021-10-23T12:24:19Z
dc.date.issued2016
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26940
dc.sourceIIOimport
dc.titleFast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs
dc.typeJournal article
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage424
dc.source.endpage431
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue3
dc.source.volume6
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7406758
imec.availabilityPublished - open access


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