dc.contributor.author | Mair, Robin | |
dc.contributor.author | Liebens, Maarten | |
dc.contributor.author | Murray, T. | |
dc.contributor.editor | Kotelyanskii, M. | |
dc.contributor.editor | Mehendale, M. | |
dc.contributor.editor | Ru, X. | |
dc.contributor.editor | Mukundhan, Priya | |
dc.contributor.editor | Kryman, Timothy | |
dc.contributor.editor | Van Huylenbroeck, Stefaan | |
dc.contributor.editor | Haensel, Leander | |
dc.contributor.editor | Miller, Andy | |
dc.contributor.editor | Beyne, Eric | |
dc.date.accessioned | 2021-10-23T12:26:01Z | |
dc.date.available | 2021-10-23T12:26:01Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26945 | |
dc.source | IIOimport | |
dc.title | Non-destructive acoustic metrology and void detection in 3x50μm TSV | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Liebens, Maarten | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 54 | |
dc.source.endpage | 59 | |
dc.source.conference | 27th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC | |
dc.source.conferencedate | 16/05/2016 | |
dc.source.conferencelocation | Saratoga, NY USA | |
dc.identifier.url | http://ieeexplore.ieee.org/document/7491103/ | |
imec.availability | Published - imec | |