Show simple item record

Non-destructive acoustic metrology and void detection in 3x50μm TSV

dc.contributor.authorMair, Robin
dc.contributor.authorLiebens, Maarten
dc.contributor.authorMurray, T.
dc.contributor.editorKotelyanskii, M.
dc.contributor.editorMehendale, M.
dc.contributor.editorRu, X.
dc.contributor.editorMukundhan, Priya
dc.contributor.editorKryman, Timothy
dc.contributor.editorVan Huylenbroeck, Stefaan
dc.contributor.editorHaensel, Leander
dc.contributor.editorMiller, Andy
dc.contributor.editorBeyne, Eric
dc.date.accessioned2021-10-23T12:26:01Z
dc.date.available2021-10-23T12:26:01Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26945
dc.sourceIIOimport
dc.titleNon-destructive acoustic metrology and void detection in 3x50μm TSV
dc.typeMeeting abstract
dc.contributor.imecauthorLiebens, Maarten
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage54
dc.source.endpage59
dc.source.conference27th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate16/05/2016
dc.source.conferencelocationSaratoga, NY USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7491103/
imec.availabilityPublished - imec


Files in this item

Thumbnail
Name:
33431.pdf
Size:
1.562Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record