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Post dry-etch cleaning issues of an organic low-K dielectric

dc.contributor.authorLanckmans, Filip
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorAlaerts, Carine
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-09-30T12:30:11Z
dc.date.available2021-09-30T12:30:11Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2705
dc.sourceIIOimport
dc.titlePost dry-etch cleaning issues of an organic low-K dielectric
dc.typeOral presentation
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.conference4th International Symposium on Ultra Clean Processing of Silicon Surfaces - UCPSS
dc.source.conferencedate21/09/1998
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - imec
imec.internalnotesPubl. in 1999; See C3571


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