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Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T13:23:39Z
dc.date.available2021-10-23T13:23:39Z
dc.date.issued2016-03
dc.identifier.issn1043-7398
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27097
dc.sourceIIOimport
dc.titleExperimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages
dc.typeJournal article
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage10902
dc.source.journalJournal of Electronic Packaging
dc.source.issue1
dc.source.volume138
dc.identifier.urlhttp://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2503785
imec.availabilityPublished - imec


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