dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | De Vos, Joeri | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-23T13:23:39Z | |
dc.date.available | 2021-10-23T13:23:39Z | |
dc.date.issued | 2016-03 | |
dc.identifier.issn | 1043-7398 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27097 | |
dc.source | IIOimport | |
dc.title | Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages | |
dc.type | Journal article | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | De Vos, Joeri | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 10902 | |
dc.source.journal | Journal of Electronic Packaging | |
dc.source.issue | 1 | |
dc.source.volume | 138 | |
dc.identifier.url | http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2503785 | |
imec.availability | Published - imec | |