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Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages
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Authors
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
De Vos, Joeri
;
Beyne, Eric
ISSN
1043-7398
Issue
1
Journal
Journal of Electronic Packaging
Volume
138
Title
Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages
Publication type
Journal article
Embargo date
9999-12-31
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