Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages

dc.contributor.author	Oprins, Herman
dc.contributor.author	Cherman, Vladimir
dc.contributor.author	Van der Plas, Geert
dc.contributor.author	De Vos, Joeri
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Oprins, Herman
dc.contributor.imecauthor	Cherman, Vladimir
dc.contributor.imecauthor	Van der Plas, Geert
dc.contributor.imecauthor	De Vos, Joeri
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Oprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimec	Van der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimec	De Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-23T13:23:39Z
dc.date.available	2021-10-23T13:23:39Z
dc.date.embargo	9999-12-31
dc.date.issued	2016-03
dc.identifier.issn	1043-7398
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/27097
dc.identifier.url	http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2503785
dc.source.beginpage	10902
dc.source.issue	1
dc.source.journal	Journal of Electronic Packaging
dc.source.volume	138
dc.title	Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages
dc.type	Journal article
dspace.entity.type	Publication
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