Publication:
Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages
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Acq. date: 2026-01-14
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3 since deposited on 2021-10-23
Acq. date: 2026-01-14
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1907 since deposited on 2021-10-23
2last month
Acq. date: 2026-01-14
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