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Technology optimization for high bandwidth density applications on 3D interposer

dc.contributor.authorPantano, Nicolas
dc.contributor.authorRoda Neve, Cesar
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDetalle, Mikael
dc.contributor.authorVerhelst, Marian
dc.contributor.authorHeyns, Marc
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T13:32:50Z
dc.date.available2021-10-23T13:32:50Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27119
dc.sourceIIOimport
dc.titleTechnology optimization for high bandwidth density applications on 3D interposer
dc.typeMeeting abstract
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorVerhelst, Marian
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVerhelst, Marian::0000-0003-3495-9263
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conferenceElectronics System-integration Technology Conference and Exhibition - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764493
imec.availabilityPublished - open access


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