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3D-SoC integration utilizing high accuracy wafer level bonding

dc.contributor.authorPeng, Lan
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorHeylen, Nancy
dc.contributor.authorReichardt, Maik
dc.contributor.authorKurz, Florian
dc.contributor.authorWagenleitner, Thomas
dc.contributor.authorSleeckx, Erik
dc.contributor.authorStruyf, Herbert
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T13:37:01Z
dc.date.available2021-10-23T13:37:01Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27129
dc.sourceIIOimport
dc.title3D-SoC integration utilizing high accuracy wafer level bonding
dc.typeProceedings paper
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage111
dc.source.endpage114
dc.source.conferenceIEEE 18th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate30/11/2016
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7861454/
imec.availabilityPublished - open access


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