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Investigation of advanced dicing technologies for ultra low-k and 3D integration

dc.contributor.authorPodpod, Arnita
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorGonzalez, Mario
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T13:46:21Z
dc.date.available2021-10-23T13:46:21Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27152
dc.sourceIIOimport
dc.titleInvestigation of advanced dicing technologies for ultra low-k and 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1247
dc.source.endpage1258
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545585/?arnumber=7545585
imec.availabilityPublished - imec


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