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The etching behavior of tungsten (W) with respect to the orientation of the grain boundary and masking layers

dc.contributor.authorLee, Hean-Cheal
dc.contributor.authorVanhaelemeersch, Serge
dc.date.accessioned2021-09-30T12:33:03Z
dc.date.available2021-09-30T12:33:03Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2715
dc.sourceIIOimport
dc.titleThe etching behavior of tungsten (W) with respect to the orientation of the grain boundary and masking layers
dc.typeJournal article
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage147
dc.source.endpage150
dc.source.journalThin Solid Films
dc.source.issue1
dc.source.volume320
imec.availabilityPublished - imec


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