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dc.contributor.authorRamaneti, Rajesh
dc.contributor.authorKorneyschuk, S.
dc.contributor.authorZhou, Y.
dc.contributor.authorKörner, C.
dc.contributor.authorLiu, X.
dc.contributor.authorAnaya Calvo, J.
dc.contributor.authorPobedinskas, Paulius
dc.contributor.authorDerluyn, J.
dc.contributor.authorFahlman, M.
dc.contributor.authorVerbeeck, J.
dc.contributor.authorKuball, M.
dc.contributor.authorHaenen, Ken
dc.date.accessioned2021-10-23T14:00:25Z
dc.date.available2021-10-23T14:00:25Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27186
dc.sourceIIOimport
dc.titleKeeping the HEMT cool withdiamond: thermal and structural interface characterization
dc.typeOral presentation
dc.contributor.imecauthorPobedinskas, Paulius
dc.contributor.imecauthorHaenen, Ken
dc.contributor.orcidimecPobedinskas, Paulius::0000-0001-8136-5172
dc.contributor.orcidimecHaenen, Ken::0000-0001-6711-7367
dc.source.peerreviewno
dc.source.conferenceE-MRS Spring Meeting
dc.source.conferencedate2/05/2016
dc.source.conferencelocationLille France
imec.availabilityPublished - imec


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