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CTE measurements for 3D package substrates using digital image correlation

dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-23T14:30:14Z
dc.date.available2021-10-23T14:30:14Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27255
dc.sourceIIOimport
dc.titleCTE measurements for 3D package substrates using digital image correlation
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference17th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectr. and Microsyst. - EuroSimE
dc.source.conferencedate17/04/2016
dc.source.conferencelocationMontpellier France
imec.availabilityPublished - imec


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