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Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

dc.contributor.authorTeugels, Lieve
dc.contributor.authorDevriendt, Katia
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTsvetanova, Diana
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBast, Gerhard
dc.contributor.authorRamkhalawon, Roshita
dc.contributor.authorMueller, Dieter
dc.contributor.authorSimpson, Gavin
dc.contributor.authorUlea, Neli
dc.date.accessioned2021-10-23T15:30:50Z
dc.date.available2021-10-23T15:30:50Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27387
dc.sourceIIOimport
dc.titleWithin-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system
dc.typeOral presentation
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBast, Gerhard
dc.contributor.imecauthorSimpson, Gavin
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewno
dc.source.conferenceYield Management Solutions China 2016
dc.source.conferencedate11/11/2016
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


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