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An improved CMP process for integration of high mobility channel materials

dc.contributor.authorTeugels, Lieve
dc.contributor.authorOng, Patrick
dc.contributor.authorAnsar, Sheik
dc.contributor.authorDelande, Tinne
dc.contributor.authorBhonsle, Rithu
dc.contributor.authorSiebert, Max
dc.contributor.authorGarcia Romero, Ivan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorLeunissen, Leonardus
dc.date.accessioned2021-10-23T15:31:47Z
dc.date.available2021-10-23T15:31:47Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27389
dc.sourceIIOimport
dc.titleAn improved CMP process for integration of high mobility channel materials
dc.typeMeeting abstract
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate17/10/2016
dc.source.conferencelocationBeijing China
dc.identifier.urlhttp://www.canevent.com/upload/microInvite/file/8491/1476432747021046704.pdf
imec.availabilityPublished - imec


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