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An improved CMP process for integration of high mobility channel materials

dc.contributor.authorTeugels, Lieve
dc.contributor.authorOng, Patrick
dc.contributor.authorUsman Ibrahim, Ansar
dc.contributor.authorDelande, Tinne
dc.contributor.authorBhonsle, Rithu
dc.contributor.authorSiebert, Max
dc.contributor.authorGarcia Romero, Ivan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorLeunissen, Leonardus
dc.date.accessioned2021-10-23T15:32:15Z
dc.date.available2021-10-23T15:32:15Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27390
dc.sourceIIOimport
dc.titleAn improved CMP process for integration of high mobility channel materials
dc.typeProceedings paper
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorUsman Ibrahim, Ansar
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewyes
dc.source.conferenceInternation Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate17/10/2016
dc.source.conferencelocationBeijing China
imec.availabilityPublished - imec


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