dc.contributor.author | van der Veen, Marleen | |
dc.contributor.author | Jourdan, Nicolas | |
dc.contributor.author | Vega Gonzalez, Victor | |
dc.contributor.author | Wilson, Chris | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Varela Pedreira, Olalla | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Boemmels, Juergen | |
dc.contributor.author | Tokei, Zsolt | |
dc.date.accessioned | 2021-10-23T16:01:34Z | |
dc.date.available | 2021-10-23T16:01:34Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27451 | |
dc.source | IIOimport | |
dc.title | Barrier/liner stacks for scaling the Cu interconnect metallization | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | van der Veen, Marleen | |
dc.contributor.imecauthor | Jourdan, Nicolas | |
dc.contributor.imecauthor | Vega Gonzalez, Victor | |
dc.contributor.imecauthor | Wilson, Chris | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Varela Pedreira, Olalla | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Boemmels, Juergen | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.orcidimec | van der Veen, Marleen::0000-0002-9402-8922 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 28 | |
dc.source.endpage | 30 | |
dc.source.conference | IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC | |
dc.source.conferencedate | 23/05/2016 | |
dc.source.conferencelocation | San Jose, CA USA | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507649 | |
imec.availability | Published - open access | |