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Barrier/liner stacks for scaling the Cu interconnect metallization

dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorWilson, Chris
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorStruyf, Herbert
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T16:01:34Z
dc.date.available2021-10-23T16:01:34Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27451
dc.sourceIIOimport
dc.titleBarrier/liner stacks for scaling the Cu interconnect metallization
dc.typeProceedings paper
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage28
dc.source.endpage30
dc.source.conferenceIEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC
dc.source.conferencedate23/05/2016
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507649
imec.availabilityPublished - open access


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