dc.contributor.author | Vanfleteren, Jan | |
dc.contributor.author | Bossuyt, Frederick | |
dc.contributor.author | Plovie, Bart | |
dc.date.accessioned | 2021-10-23T16:20:21Z | |
dc.date.available | 2021-10-23T16:20:21Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27491 | |
dc.source | IIOimport | |
dc.title | A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.imecauthor | Bossuyt, Frederick | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.contributor.orcidimec | Bossuyt, Frederick::0000-0003-3350-9295 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1 | |
dc.source.endpage | 4 | |
dc.source.conference | 2016 12th International Congress Molded Interconnect Devices (MID) | |
dc.source.conferencedate | 28/09/2016 | |
dc.source.conferencelocation | Wurzburg Germany | |
dc.identifier.url | https://ieeexplore.ieee.org/document/7738924 | |
imec.availability | Published - open access | |