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Cost comparison of different TSV implementation options

dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorJourdain, Anne
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T16:28:48Z
dc.date.available2021-10-23T16:28:48Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27508
dc.sourceIIOimport
dc.titleCost comparison of different TSV implementation options
dc.typeProceedings paper
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage295
dc.source.endpage301
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545447/?arnumber=7545447
imec.availabilityPublished - imec


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