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Vertical nanowire FET integration and device aspects

dc.contributor.authorVeloso, Anabela
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorBrus, Stephan
dc.contributor.authorChan, BT
dc.contributor.authorCupak, Miroslav
dc.contributor.authorDehan, Morin
dc.contributor.authorDelvaux, Christie
dc.contributor.authorDevriendt, Katia
dc.contributor.authorEneman, Geert
dc.contributor.authorErcken, Monique
dc.contributor.authorHuynh Bao, Trong
dc.contributor.authorIvanov, Tsvetan
dc.contributor.authorMatagne, Philippe
dc.contributor.authorMerckling, Clement
dc.contributor.authorParaschiv, Vasile
dc.contributor.authorRamesh, Siva
dc.contributor.authorRosseel, Erik
dc.contributor.authorRynders, Luc
dc.contributor.authorSibaja-Hernandez, Arturo
dc.contributor.authorSuhard, Samuel
dc.contributor.authorTao, Zheng
dc.contributor.authorVecchio, Emma
dc.contributor.authorWaldron, Niamh
dc.contributor.authorYakimets, Dmitry
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorMocuta, Dan
dc.contributor.authorCollaert, Nadine
dc.contributor.authorThean, Aaron
dc.date.accessioned2021-10-23T16:30:05Z
dc.date.available2021-10-23T16:30:05Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27510
dc.sourceIIOimport
dc.titleVertical nanowire FET integration and device aspects
dc.typeProceedings paper
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorDelvaux, Christie
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorIvanov, Tsvetan
dc.contributor.imecauthorMatagne, Philippe
dc.contributor.imecauthorMerckling, Clement
dc.contributor.imecauthorParaschiv, Vasile
dc.contributor.imecauthorRamesh, Siva
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorRynders, Luc
dc.contributor.imecauthorSibaja-Hernandez, Arturo
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorTao, Zheng
dc.contributor.imecauthorVecchio, Emma
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorYakimets, Dmitry
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorThean, Aaron
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecIvanov, Tsvetan::0000-0003-3407-2742
dc.contributor.orcidimecMerckling, Clement::0000-0003-3084-2543
dc.contributor.orcidimecRamesh, Siva::0000-0002-8473-7258
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage31
dc.source.endpage42
dc.source.conferenceSilicon Compatible Materials, Processes and Technologies for Advanced Integrated Circuits and Emerging Applications 6
dc.source.conferencedate29/05/2016
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://ecst.ecsdl.org/content/72/4/31.abstract
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 72, Issue 4


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