Problems associated with the high-frequency characterisation of high-density electronic packaging

dc.contributor.author	Martens, Luc
dc.date.accessioned	2021-10-01T08:29:42Z
dc.date.available	2021-10-01T08:29:42Z
dc.date.issued	1998
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/2753
dc.source	IIOimport
dc.title	Problems associated with the high-frequency characterisation of high-density electronic packaging
dc.type	Proceedings paper
dc.contributor.imecauthor	Martens, Luc
dc.date.embargo	9999-12-31
dc.source.peerreview	no
dc.source.beginpage	157
dc.source.endpage	161
dc.source.conference	Workshop Proceedings of the 28th European Microwave Conference: Workshop on High-Frequency Measurement Techniques for ...
dc.source.conferencedate	9/10/1998
dc.source.conferencelocation	Amsterdam The Netherlands
imec.availability	Published - open access