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Application of 3D X-ray microscopy for 3D IC process development

dc.contributor.authorWang, Teng
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorGu, Allen
dc.contributor.authorEstrada, Raleigh
dc.date.accessioned2021-10-23T17:04:31Z
dc.date.available2021-10-23T17:04:31Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27575
dc.sourceIIOimport
dc.titleApplication of 3D X-ray microscopy for 3D IC process development
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.conferenceInternational Wafer Level Packaging Conference - IWLPC
dc.source.conferencedate18/10/2016
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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