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Height uniformity of micro-bumps electroplated on thin Cu seed layers

dc.contributor.authorYang, Liu
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorHonore, Mia
dc.contributor.authorStiers, Karen
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVereecken, Philippe
dc.contributor.authorRadisic, Alex
dc.date.accessioned2021-10-23T17:29:23Z
dc.date.available2021-10-23T17:29:23Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27624
dc.sourceIIOimport
dc.titleHeight uniformity of micro-bumps electroplated on thin Cu seed layers
dc.typeProceedings paper
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorStiers, Karen
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage145
dc.source.endpage152
dc.source.conferenceSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6
dc.source.conferencedate29/05/2016
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://ecst.ecsdl.org/content/72/4/145.abstract
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 72, Issue 4


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