Height uniformity of micro-bumps electroplated on thin Cu seed layers

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Authors
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex
Conference
229th Electrochemical Society Meeting
Title
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Publication type
Meeting abstract
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