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Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation

dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCiofi, Ivan
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T17:42:28Z
dc.date.available2021-10-23T17:42:28Z
dc.date.issued2016
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27647
dc.sourceIIOimport
dc.titleDesign considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
dc.typeJournal article
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage102
dc.source.endpage107
dc.source.journalMicroelectronics Reliability
dc.source.volume59
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271416300154
imec.availabilityPublished - imec


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