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Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
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Authors
Zahedmanesh, Houman
;
Gonzalez, Mario
;
Ciofi, Ivan
;
Croes, Kristof
;
Boemmels, Juergen
;
Tokei, Zsolt
ISSN
0026-2714
Journal
Microelectronics Reliability
Volume
59
Title
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
Publication type
Journal article
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