Publication:
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
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1877 since deposited on 2021-10-23
2last month
Acq. date: 2026-08-24
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Statistics
Views
1877 since deposited on 2021-10-23
2last month
Acq. date: 2026-08-24
Citations