Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation

dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Ciofi, Ivan
dc.contributor.author	Croes, Kristof
dc.contributor.author	Boemmels, Juergen
dc.contributor.author	Tokei, Zsolt
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Ciofi, Ivan
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.imecauthor	Boemmels, Juergen
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.orcidimec	Ciofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.date.accessioned	2021-10-23T17:42:28Z
dc.date.available	2021-10-23T17:42:28Z
dc.date.issued	2016
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/27647
dc.identifier.url	http://www.sciencedirect.com/science/article/pii/S0026271416300154
dc.source.beginpage	102
dc.source.endpage	107
dc.source.journal	Microelectronics Reliability
dc.source.volume	59
dc.title	Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
dc.type	Journal article
dspace.entity.type	Publication
Files
Publication available in collections:	Articles