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dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorHeylen, Nancy
dc.contributor.authorWen, Liang Gong
dc.contributor.authorWilson, Chris
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhail
dc.date.accessioned2021-10-23T17:51:08Z
dc.date.available2021-10-23T17:51:08Z
dc.date.issued2016
dc.identifier.issn0022-3727
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27663
dc.sourceIIOimport
dc.titleIntegration of porous low-k dielectrics using post porosity pore protection
dc.typeJournal article
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.source.peerreviewyes
dc.source.beginpage505105
dc.source.journalJournal of Physics D: Applied Physics
dc.source.issue50
dc.source.volume49
dc.identifier.urlhttp://iopscience.iop.org/article/10.1088/0022-3727/49/50/505105/meta
imec.availabilityPublished - imec


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