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Transceivers for 400G based on hybrid integrated thick SOI and III/V chips

dc.contributor.authorAalto, T.
dc.contributor.authorHarjanne, M.
dc.contributor.authorVehmas, T.
dc.contributor.authorKarppinen, M.
dc.contributor.authorSitomaniemi, A.
dc.contributor.authorMalacarne, A.
dc.contributor.authorNeumeyr, C.
dc.contributor.authorBauwelinck, Johan
dc.date.accessioned2021-10-24T02:50:43Z
dc.date.available2021-10-24T02:50:43Z
dc.date.issued2017-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27690
dc.sourceIIOimport
dc.titleTransceivers for 400G based on hybrid integrated thick SOI and III/V chips
dc.typeProceedings paper
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage3
dc.source.conference43rd European Conference on Optical Communication - ECOC
dc.source.conferencedate17/09/2017
dc.source.conferencelocationGoteborg Sweden
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8345865
imec.availabilityPublished - open access


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