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The formation of Pd seeded copper layer on TiN substrates by electroless deposition

dc.contributor.authorMin, Woo Sig
dc.contributor.authorLantasov, Yuri
dc.contributor.authorPalmans, Roger
dc.contributor.authorMaex, Karen
dc.contributor.authorLee, D. N.
dc.date.accessioned2021-10-01T08:30:43Z
dc.date.available2021-10-01T08:30:43Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2771
dc.sourceIIOimport
dc.titleThe formation of Pd seeded copper layer on TiN substrates by electroless deposition
dc.typeOral presentation
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference; 6-8 Oct. 1998; Colorado Springs, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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