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Enabling porous low-k dielectric sealing in 22nm half-pitch (dual)damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability

dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-24T02:53:04Z
dc.date.available2021-10-24T02:53:04Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27763
dc.sourceIIOimport
dc.titleEnabling porous low-k dielectric sealing in 22nm half-pitch (dual)damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability
dc.typeOral presentation
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewno
dc.source.conferenceAVS 64th International Symposium
dc.source.conferencedate29/10/2017
dc.source.conferencelocationTampa Florida
imec.availabilityPublished - imec


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