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Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability

dc.contributor.authorArmini, Silvia
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorDelande, Tinne
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorWilson, Chris
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-24T02:53:11Z
dc.date.available2021-10-24T02:53:11Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27765
dc.sourceIIOimport
dc.titleEnabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate16/05/2017
dc.source.conferencelocationHsinchu Taiwan
imec.availabilityPublished - open access


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