dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Wang, Teng | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Lofrano, Melina | |
dc.contributor.author | Capuz, Giovanni | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-24T02:59:02Z | |
dc.date.available | 2021-10-24T02:59:02Z | |
dc.date.issued | 2017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27843 | |
dc.source | IIOimport | |
dc.title | Thermal compression bonding: understanding heat transfer by in situ measurement and modeling | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Lofrano, Melina | |
dc.contributor.imecauthor | Capuz, Giovanni | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.beginpage | 392 | |
dc.source.endpage | 398 | |
dc.source.conference | IEEE Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 30/05/2017 | |
dc.source.conferencelocation | Orlando, FL USA | |
imec.availability | Published - imec | |