dc.contributor.author | Brand, Sebastian | |
dc.contributor.author | Kogel, Michael | |
dc.contributor.author | Altmann, Frank | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Khaled, Ahmad | |
dc.contributor.author | Moore, Michael J. | |
dc.contributor.author | Strohm, Eric M. | |
dc.contributor.author | Kolios, Michael C. | |
dc.contributor.author | Strohm, Eric. M. | |
dc.date.accessioned | 2021-10-24T03:09:47Z | |
dc.date.available | 2021-10-24T03:09:47Z | |
dc.date.issued | 2017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27927 | |
dc.source | IIOimport | |
dc.title | Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Khaled, Ahmad | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Khaled, Ahmad::0000-0003-2892-3176 | |
dc.source.peerreview | yes | |
dc.source.conference | 43rd Intenational Symposium for Testing and Failure Analysis - ISTFA | |
dc.source.conferencedate | 5/11/2017 | |
dc.source.conferencelocation | Pasadena, CA USA | |
imec.availability | Published - imec | |