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Statistical distribution of through-silicon via Cu pumping

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorRoussel, Philippe
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVan der Donck, Tom
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorStucchi, Michele
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-24T03:51:19Z
dc.date.available2021-10-24T03:51:19Z
dc.date.issued2017
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28137
dc.sourceIIOimport
dc.titleStatistical distribution of through-silicon via Cu pumping
dc.typeJournal article
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage549
dc.source.endpage559
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.issue3
dc.source.volume17
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8007314/
imec.availabilityPublished - open access


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