Publication:

Statistical distribution of through-silicon via Cu pumping

Date

2017

Journal article

Simple item page Full metadata Statistics

Files

35128.pdf 2.65 MB

Author(s)

De Messemaeker, Joke

;

Roussel, Philippe

;

Varela Pedreira, Olalla

;

Van der Donck, Tom

;

Van Huylenbroeck, Stefaan

;

;

De Wolf, Ingrid

;

Stucchi, Michele

;

Journal

IEEE Transactions on Device and Materials Reliability

Metrics

1895 since deposited on 2021-10-24

Acq. date: 2026-01-07