Statistical distribution of through-silicon via Cu pumping

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Author(s)

De Messemaeker, Joke

;

Roussel, Philippe

;

Varela Pedreira, Olalla

;

Van der Donck, Tom

;

Van Huylenbroeck, Stefaan

;

;

De Wolf, Ingrid

;

Stucchi, Michele

;

Journal

IEEE Transactions on Device and Materials Reliability

Metrics

1890 since deposited on 2021-10-24

Acq. date: 2025-10-24