Publication:

Statistical distribution of through-silicon via Cu pumping

Date

2017
Journal article
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dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorRoussel, Philippe
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVan der Donck, Tom
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorStucchi, Michele
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-24T03:51:19Z
dc.date.available2021-10-24T03:51:19Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28137
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8007314/
dc.source.beginpage549
dc.source.endpage559
dc.source.issue3
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.volume17
dc.title

Statistical distribution of through-silicon via Cu pumping

dc.typeJournal article
dspace.entity.typePublication
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