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Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings

dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBex, Pieter
dc.contributor.authorFodor, Ferenc
dc.contributor.authorCherman, Vladimir
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T03:53:57Z
dc.date.available2021-10-24T03:53:57Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28149
dc.sourceIIOimport
dc.titleImproving solder wetting of micro bumps on metal pads using metallic or organic pad coatings
dc.typeProceedings paper
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage8.9
dc.source.conferenceIEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference - IEEE S3S
dc.source.conferencedate16/10/2017
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8309263/
imec.availabilityPublished - open access


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