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Probing of large-array, fine-pitch microbumps for 3D ICs

dc.contributor.authorFodor, Ferenc
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorKiesewetter, Joerg
dc.contributor.authorSmith, Ken
dc.date.accessioned2021-10-24T04:46:55Z
dc.date.available2021-10-24T04:46:55Z
dc.date.issued2017-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28344
dc.sourceIIOimport
dc.titleProbing of large-array, fine-pitch microbumps for 3D ICs
dc.typeProceedings paper
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceNI Week Engineering Impact Award
dc.source.conferencedate22/05/2017
dc.source.conferencelocationAustin, TX USA
dc.identifier.urlhttp://sine.ni.com/cs/app/doc/p/id/cs-17384#
imec.availabilityPublished - imec
imec.internalnotesPublished as Case Study at www.ni.com


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