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Connected component analysis of review-SEM images for sub-10nm node process verification

dc.contributor.authorHalder, Sandip
dc.contributor.authorLeray, Philippe
dc.contributor.authorSah, Kaushik
dc.contributor.authorCross, Andrew
dc.contributor.authorParisi, Paolo
dc.date.accessioned2021-10-24T05:23:22Z
dc.date.available2021-10-24T05:23:22Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28450
dc.sourceIIOimport
dc.titleConnected component analysis of review-SEM images for sub-10nm node process verification
dc.typeProceedings paper
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorSah, Kaushik
dc.contributor.imecauthorCross, Andrew
dc.contributor.imecauthorParisi, Paolo
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage101451Y
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXXI
dc.source.conferencedate25/02/2017
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=2615869
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 10145


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