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dc.contributor.authorHeremans, Paul
dc.date.accessioned2021-10-24T05:35:44Z
dc.date.available2021-10-24T05:35:44Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28484
dc.sourceIIOimport
dc.titlePresent and future technologies and applications of thin-film circuitry on flexible substrates
dc.typeProceedings paper
dc.contributor.imecauthorHeremans, Paul
dc.contributor.orcidimecHeremans, Paul::0000-0003-2151-1718
dc.source.peerreviewno
dc.source.conferenceInternational Conference on Flexible and Printed Electronics - ICFPE
dc.source.conferencedate5/09/2017
dc.source.conferencelocationJeju Korea
imec.availabilityPublished - imec


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